Technical Publications: conference, journal, magazine.

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Best Paper APEX 2024 – A Parametric Approach to Quantifying the Environmental Impact of PCB Manufacturing

1 file(s) 717.15 KB

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IEEE Transactions Device and Materials reliability – September 2018: Methodology for Solder-Joint Lifetime Prediction of LED-Based PCB Assemblies

1 file(s) 2.00 MB

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Global SMT & Packaging September 2010: Predicting Delamination in Lead-free Assembly

1 file(s) 1.56 MB

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EPTC 2011: Green Mould Compounds: Impact on Second Level Interconnect Reliability

1 file(s) 765.40 KB

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ESTC 2012: Early Fatigue Failures in Copper Wire Bonds Inside Packages with low CTE Green Mold Compounds

1 file(s) 421.07 KB

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EMC Europe 2013: Modeling the Low- and High-Frequency Impedance of Thermal Reliefs

1 file(s) 467.83 KB

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IMAPS-EMPC 2013: Impact of Pad Finish on Mechanical Shock Resistance of Lead-Free Solder Joints Tested Under Shear and in Pull Mode

1 file(s) 651.15 KB

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Global SMT & Packaging April 2014: New Brittle Fracture Test Reveals Importance of Choosing the Right Board Finish

1 file(s) 165.51 KB
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Reduced 2nd Level Solder Joint Life Time of Low-CTE Mold Compound Packages – Publication

1 file(s) 1.03 MB

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Going Green CARE Innovation 2014: Material Identification in Electronics

1 file(s) 1.77 MB

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