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Publications: conference, journal, magazine, brochure.
Material Identification in Electronics – Going Green CARE 2014
1 file(s) 449 KB
La directive RoHS
1 file(s) 1 MB
The RoHS Directive
1 file(s) 1 MB
De RoHS richtlijn
1 file(s) 801 KB
Best Paper APEX 2024 – A Parametric Approach to Quantifying the Environmental Impact of PCB Manufacturing
1 file(s) 717.15 KB
IEEE Transactions Device and Materials reliability – September 2018: Methodology for Solder-Joint Lifetime Prediction of LED-Based PCB Assemblies
1 file(s) 2.00 MB
Global SMT & Packaging September 2010: Predicting Delamination in Lead-free Assembly
1 file(s) 1.56 MB
EPTC 2011: Green Mould Compounds: Impact on Second Level Interconnect Reliability
1 file(s) 765.40 KB
ESTC 2012: Early Fatigue Failures in Copper Wire Bonds Inside Packages with low CTE Green Mold Compounds
1 file(s) 421.07 KB
EMC Europe 2013: Modeling the Low- and High-Frequency Impedance of Thermal Reliefs
1 file(s) 467.83 KB
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