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Publications: conference, journal, magazine, brochure.
EMC Europe 2013: Modeling the Low- and High-Frequency Impedance of Thermal Reliefs
1 file(s) 468 KB
IMAPS-EMPC 2013: Impact of Pad Finish on Mechanical Shock Resistance of Lead-Free Solder Joints Tested Under Shear and in Pull Mode
1 file(s) 651 KB
Global SMT & Packaging April 2014: New Brittle Fracture Test Reveals Importance of Choosing the Right Board Finish
1 file(s) 166 KB
Eurosime 2014: Hidden Head-In-Pillow Soldering Failures
1 file(s) 1,008 KB
Eurosime 2015: Impact of Solder-Joint Tilting on the Reliability of LED-based PCB Assemblies
1 file(s) 1 MB
cEDM: Center for Electronics Design & Manufacturing – SPM Magazine March 2016
1 file(s) 262.97 KB
Eurosime 2016: Four-point Bending Cycling as Alternative for Thermal Cycling Solder fatigue Testing
1 file(s) 845 KB
ICEP 2016: How the Mold Compound Thermal Expansion Overrules the Solder Composition Choice in Board Level Reliability Performance
1 file(s) 798 KB
Geneess guideline
1 file(s) 2.50 MB
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