Your basket is currently empty!
Reliability & Maintenance
ESA Workshop 2014: Reduced 2nd Level Solder Joint Life time of Low-CTE Mold Compound Packages
1 file(s) 1 MB
Reliability of Solder Joints for LED Applications
1 file(s) 4 MB
New Product Introduction Methodology for Reliable Smart Products
1 file(s) 3 MB
State of the art on Prognostic Health Monitoring for Electronic Systems
1 file(s) 709 KB
Data-driven system health monitoring
1 file(s) 2 MB
Physics-of-Failure Based Reliability Assessment of Electronics
1 file(s) 1 MB
Physics of Failure Based Quantification of Life Time for Electronics Board Assemblies
1 file(s) 5 MB
Reduced 2nd Level Solder Joint Life time of Low-CTE Mold Compound Packages
1 file(s) 1 MB
Impact of Green Mold Compounds on First- and Second-Level Interconnect
1 file(s) 5 MB
Green IC Packaging: A Threath to Electronics Reliability
1 file(s) 3 MB