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Reliability & Maintenance
Failure Risk Assessment FMEA
1 file(s) 3 MB
EDM-Q-014 Robustness Testing and Qualification
1 file(s) 1 MB
EDM-D-014 Design-for-Robustness
1 file(s) 882 KB
IEEE Transactions Device and Materials reliability – September 2018: Methodology for Solder-Joint Lifetime Prediction of LED-Based PCB Assemblies
1 file(s) 2.00 MB
EPTC 2011: Green Mould Compounds: Impact on Second Level Interconnect Reliability
1 file(s) 765.40 KB
ESTC 2012: Early Fatigue Failures in Copper Wire Bonds Inside Packages with low CTE Green Mold Compounds
1 file(s) 421 KB
Global SMT & Packaging April 2014: New Brittle Fracture Test Reveals Importance of Choosing the Right Board Finish
1 file(s) 166 KB
Eurosime 2015: Impact of Solder-Joint Tilting on the Reliability of LED-based PCB Assemblies
1 file(s) 1 MB
Eurosime 2016: Four-point Bending Cycling as Alternative for Thermal Cycling Solder fatigue Testing
1 file(s) 845 KB
ICEP 2016: How the Mold Compound Thermal Expansion Overrules the Solder Composition Choice in Board Level Reliability Performance
1 file(s) 798 KB