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Presentations
Integration of Electronincs on Textiles by Means of Coating, Lamination, Adhesives or Embedding
1 file(s) 3.10 MB
Electrical Interconnections for Electronics and Textiles
1 file(s) 2.19 MB
Overview of the Methods in the Risk Analysis Toolbox
1 file(s) 3.54 MB
Failure Risk Assessment through an FMEA Methodology
1 file(s) 1.32 MB
Pred-X 2.0 : a BOM-Based Prediction of the Assembly Flow of Your Product
1 file(s) 3.70 MB
Quantifying Quality of PBA and Mechatronics
1 file(s) 3.22 MB
Quality Analysis of PBA Using the Pred-X Tool
1 file(s) 932.17 KB
The MoVIP project: Quantifying Zero Hour Defect Rate (ZHDR)
1 file(s) 1.44 MB
Assembly Flow Modeling: a new DfA Tool
1 file(s) 1.90 MB
Good Design to Assembly Matching Leads to Cost Effective Solutions
1 file(s) 3.70 MB
Component Package Selection in Automotive Electronics
1 file(s) 2.21 MB
Package and Interconnection Failure Assessment
1 file(s) 12.74 MB
The GreenElec Project
1 file(s) 1.45 MB
Recycling of e-waste
1 file(s) 2.42 MB
Conductive Adhesives and Underfill: Technology and Applications
1 file(s) 1.04 MB
Assembly Material Related Failures and EDM-D-003 Guideline
1 file(s) 1.86 MB
Build-Up Options Versus Density Classes: How to Choose the Right PCB Technology
1 file(s) 217.13 KB
Implementation of the PBA Passport Tool to Handle the Density Classes
1 file(s) 502.02 KB
Invomec – More than 25 Years of Services
1 file(s) 1.11 MB
Asic vs FPGA: a Business Perspective
1 file(s) 3.11 MB