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Presentations
Failure Mechanisms Turned into an Asset: New Ways of Embedding Key Security Elements in IC’s
1 file(s) 1.96 MB
Low Melting Point Solder Technology for Advanced Processor Components
1 file(s) 3 MB
Package and Interconnection Failure Assessment
1 file(s) 12.74 MB
Safety Assurance of Autonomous Systems
1 file(s) 4.69 MB
Implementation of the PBA Passport Tool to Handle the Density Classes
1 file(s) 502.02 KB
EDM Event 2011 booths
1 file(s) 237.08 KB
A System Engineering Approach to Smart Product Exploration
1 file(s) 1.70 MB
Digitalization in the Electronics Industry
1 file(s) 4 MB
Reliable Electronics for Aerospace
1 file(s) 3.32 MB
Quality Analysis of PBA Using the Pred-X Tool
1 file(s) 932.17 KB
Towards Physics-of-Failure Based “Reliable-by-Design” Electronics
1 file(s) 2.53 MB
Systems Engineering
1 file(s) 5.97 MB
Environmental impact assessment What and How – AE2026
1 file(s) 566.32 KB
The GreenElec Project
1 file(s) 1.45 MB
How to Design a PBA with Build-In Quality and Reliability
1 file(s) 1.41 MB
cEDM Activities from a Business Perspective
1 file(s) 3.52 MB
A System Engineering Approach to Smart Product Exploration: Business Analysis and Stakeholder Needs & Requirements
1 file(s) 1.17 MB
Invomec – More than 25 Years of Services
1 file(s) 1.11 MB
Novel PCB Technology Allowing Alternative Carrier Materials
1 file(s) 298.30 KB
Succesful Innovation with Smart Products and IoT
1 file(s) 2.21 MB