In order to avoid extra delays and costs, EMC issues have to be searched for, investigated and solved at every stage of the design process and at every level (ICs, PCBs, modules, systems,…). Moreover, legal EMC requirements are becoming more stringent as they will not only ask to show compliance at the moment of placing […]
Imec’s Center of Electronics Design & Manufacturing activities are aimed at supporting the industry in the development of cost effective quality electronics. When improved, multidisciplinary insight in the physical realisation of electronics throughout the electronic supply chain is brought to the operational departments and factory floor by means of guidelines, tools, consultancy and training this […]
Op 13 & 14 maart 2014 vond de Nieuw Industrieel Ondernemen Happening plaats, de apotheose na een campagne op Kanaal Z en de regionale zenders. Met een job- en stagebeurs in samenwerking met VDAB, kende de eerste dag een groot succes met een talrijke aanwezigheid van bedrijven en jobzoekenden.Véronique Goossens modereerde enkele panelgesprekken. Bieke Illeghems […]
The selection of components that make up the Bill-of-Material, especially the package type selection, determines the manufacturability and the reliability of the Printed Board Assembly. This workshop presents the EDM-D-002: Electronic Component Specification guideline. It addresses the specification of assembly aspects of components like Moisture and Process Sensitivity levels, solder process compatibility and quality (yield) […]
Low cost, high quality manufacturing demands a proper design. Placement of components need to be aligned with assembly process flow, capability and equipment. This workshop presents the EDM-D-004: Design-for-Assembly guideline. The guideline provides general requirements and recommendations regarding Design-for-Assembly of printed boards. It treats automated board handling, PBA type selection, component placement, compatibility with different […]
Safety is of increasing importance in industrial environments. The international standard EN-IEC-61508 defines the requirements for the functional safety circuits and the procedure for performing a safety assessment. This procedure consists of 3 steps: hazard and risk analysis, safety function definition and SIL (Safety Integrity Level) validation.In the validation process, reliability quantification of parts used […]
Presentation: Bart Vandevelde, imec Publication Location: ESA-ESTEC, Nederland
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and MicrosystemsEuroSimE 2014 will be hosted in the beautiful city Ghent. The conference will address the results of both fundamental research and industrial applications for thermal, mechanical and multiphysics simulation and experiments of micro/nano-electronics and microsystems. Location: Mariott hotel, Gent
