EDM-D-008 Technology and Manufacturing Capability Mapping of PBA Designs – V1.2 (2017)

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EDM-D-007 Quality and Test Coverage Quantification – V1.3 (2017)

File Size 1 MB
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EDM-D-006 Layout Solutions – V1.2 (2017)

File Size 1 MB
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EDM-D-004 Design-for-Assembly – V1.1 (2017)

File Size 1 MB
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EDM-D-003 PBA Assembly Material Specification – V1.4 (2019)

File Size 650 KB
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EDM-D-002 Component Specification – V1.3 (2017)

File Size 484 KB
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IEEE Transactions Device and Materials reliability – September 2018: Methodology for Solder-Joint Lifetime Prediction of LED-Based PCB Assemblies

File Size 2.00 MB
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Global SMT & Packaging September 2010: Predicting Delamination in Lead-free Assembly

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EPTC 2011: Green Mould Compounds: Impact on Second Level Interconnect Reliability

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EMC Europe 2013: Modeling the Low- and High-Frequency Impedance of Thermal Reliefs

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