IMAPS-EMPC 2013: Impact of Pad Finish on Mechanical Shock Resistance of Lead-Free Solder Joints Tested Under Shear and in Pull Mode

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Global SMT & Packaging April 2014: New Brittle Fracture Test Reveals Importance of Choosing the Right Board Finish

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Going Green CARE Innovation 2014: Material Identification in Electronics

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Eurosime 2014: Hidden Head-In-Pillow Soldering Failures

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Eurosime 2015: Impact of Solder-Joint Tilting on the Reliability of LED-based PCB Assemblies

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PBA Reliability Seminar 2018

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PBA Technology Seminar 2018 Newtec

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PBA Technology Seminar 2018 TBP

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Reliability of Alternative Solder Materials – part 2 – video

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Reliability of Alternative Solder Materials – part 2

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