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Showing 1–32 of 46 results

  • BOM DfM Checklist

    The 'Bill-Of-Material (BOM) DfM Checklist' provides a structurized and comprehensive list of electronic component packaging properties with regard to the terminal, material, legislation and assembly properties. Available to members only: free download.

    0.00
  • CE Certification

    CE certification guideline: definitions, general principles, conformity assessment, responsibilities, relevant directives. Free download for members.

    50.00
  • Certification of Electronic Medical Devices

    Introductory guideline for certification per CE (EU) and FDA (US) requirements of electronic medical devices. Free download for members.

    50.00
  • Component Specification

    Component selection to ensure compatibility with the assembly processes, maximize assembly yield and obtain a reliable PBA. Free download for members.

    50.00
  • Design of Electronic Medical Devices

    Design guideline for electronics for medical applications to be CE (EU) and FDA (US) certified. Free download for members.

    50.00
  • Design-for-Assembly

    Design-for-Assembly guideline: assembly flow selection, BOM build-up, component placement, soldering processes, press-fit, palletization, rework, cleaning, traceability. Free download for members.  

    80.00
  • Design-for-Robustness

    Robustness is the ability to withstand excessive loads beyond normal operational conditions. This guideline provides ways to reduce loads on PBA and strengthen the PBA against these loads. Mechanical, thermal, electrical, liquids and various environmental loads are treated. Free download for members.

    80.00
  • EDM Code Generator

    Supporting tool for Pred-X: EDM Package Code Generator. REQUEST QUOTE

    0.00
  • Electro-Magnetic Compatibility

    Electro-Magnetic Compatibility design guideline. Free download for members.

    50.00
  • Electronic Assembly Technology Qualification “A White Box approach”

    Technology qualification guideline for PBA: qualification techniques; white-box technology qualification: component, substrate, material, assembly qualification; validation. Free download for members.

    50.00
  • Extracting DPMO Values from Production Data

    How to extract defect rates expressed as Defect Per Million Opportunity (DPMO) numbers from PBA assembly yield figures. Free download for members.

    50.00
  • Failure Risk Assessment FMEA

    Printed Board Assembly defect and failure assessment tool (FMEA). Available to members only: free download.

    0.00
  • Good Design-for-X Practice

    General Good Design-for-X practices. Free download.

    0.00
  • IPC Class 2 vs IPC Class 3 – Assembly View

    This document compares IPC Class 2 with IPC Class 3 concerning the assembly of printed circuit boards and gives an overview of all IPC Class 2/3 differences of the IPC performance standard J-STD-001 'Requirements for Soldered Electrical and Electronic Assemblies'. Available to members only: free download.

    0.00
  • IPC Standards Guide

    The 'IPC Standards Guide' is intended to help the user in localising specific Printed Circuit Board (PCB) and Printed Board Assembly (PBA) information in IPC standards. Available to members only: free download.

    0.00
  • Layout Solutions

    Capita selecta of layout solutions: board layout, reflow and wave footprint design, BGA fan-out, bottom termination components (QFN et al.) Free download for members.

    80.00
  • Life-Cycle Profiling of Electronics

    Life-cycle profiling guideline for electronics: electronics in a system, life-cycle profiling and its parameters, dominant failure modes and their relationship with loading. Free download for members.

    50.00
  • Material Composition

    Material in PBA locator. REQUEST QUOTE

    0.00
  • Mechanical Integration

    Guideline to minimize risk of mechanical failures of PBA: estimating mechanical load, mechanical failure mitigation SMD and through-hole components. Free download for members.

    80.00
  • New Product Exploration. A system engineering approach.

    Product life-cycle management guideline New Product Exploration stage aligned with ISO/IEC/IEEE 24748-1: NPE life-cycle processes and stage gating, exploration and validation techniques, electronics in the NPE stage, application by SME. Free download for members.

    50.00
  • New Product Introduction of Electronics

    Product life-cycle management guideline New Product Exploration stage aligned with ISO/IEC/IEEE 24748-1: NPI life-cycle processes and stage gating. Free download for members.

    50.00
  • New Product Planning. A system engineering approach.

    Product life-cycle management guideline New Product Exploration stage aligned with ISO/IEC/IEEE 24748-1: NPP life-cycle processes and stage gating, electronics in the NPP stage, application by SME. Free download for members.

    50.00
  • NPI Questionnaire

    The 'NPI Questionnaire' provides a structurized methodology to collect basic information regarding the Printed Board Assembly (PBA) product development context. Available to members only: free download.

    0.00
  • PBA Assembly Material Specification

    Specification of assembly materials: flux, solder, adhesives, coating... Free download for members.

    50.00
  • PBA Checklist

    The 'Printed Board Assembly (PBA) Checklist' provides a comprehensive overview and checklist of assembly parameters that are critical to PBA quality and reliability. Available to members only: free download.

    0.00
  • PBA Design-to-Manufacturing Mapping

    Tool to map a PBA design to the PCB and electronic assembly suppliers' capabilities. Available to members only: free download.

    0.00
  • PBA Passport

    The 'PBA Passport' identifies and lists the PBA design features that determine the technologies and the manufacturing capability required to realize the PBA design. It is a basic tool for Design-for-X evaluation and for design-to-manufacturing mapping. Available to members only: free download.

    0.00
  • PCB Laminate Overview

    The 'Laminate Overview' is intended to support you in specifying and realising cost-effective, high quality Printed Board Assemblies. Available to members only: free download.

    0.00
  • PCB Specification

    PCB specification: performance, laminate selection, solderable finish selection, solder mask, PCB identification, outgassing. Free download for members.

    100.00
  • Power Integrity

    Power integrity design guideline. Free download for members.

    50.00
  • Pred-X

    Pred-X predicts the quality and test coverage of Printed Board Assemblies (PBA) solely based on Bill-of-Material (BOM) and basic assembly information. Pred-X assists Design-for-Assembly, Design-for-Test and assembly preparation by quantifying the impact of component, assembly and test options. REQUEST QUOTE

    0.00
  • Predictive Product Life Cycle Management of Electronics “A White Box Approach”

    Product life-cycle management guideline for electronics: life-cycle stage gating, technology, product and component development, predictive PLCM, enabling systems and supporting activities. Free download for members.

    50.00