Workshop

Designing and manufacturing electronics in today’s competitive world of outsourced activities is a complex situation, both for customer and service provider. Do you recognize the constant challenges of new customer requests, new technology, changing legislation and increasing product demands in your electronics projects, whether in house or outsourced? Is your supply chain becoming increasingly complex […]

De ontwikkelingen in de wereld van elektronica blijven elkaar pijlsnel opvolgen. Nieuwe technologie, wijzigende wetgeving, toenemende producteisen. Kan u ondersteuning gebruiken in uw ontwikkelingen?Invomec, een afdeling van imec, biedt sinds meer dan 25 jaar ondersteuning aan bedrijven, in een steeds bredere waaier van elektronica training, advies en dienstverlening. Misschien ook iets voor u? Tijdens deze […]

The DfM guideline on PCB build-up and density classification, what’s in it for you?What choices to make for the PCB build-up? Will your design require six or eight layers, or even more…? Is it OK to use microVIA’s in your design? When using a small pitch BGA, will you use minimum track width and spacing […]

Electronics assembly materials like soldering fluxes, solder pastes, adhesives and coatings have a major impact on the final product quality and reliability. Improper selection and/or application may lead to severe surface insulation (SIR) failures and corrosion. Despite these risks assembly materials are rarely specified beyond “no-clean”, leaving the selection entirely to the production unit. Very […]

Recycling treats complex waste streams containing precious and other metals and materials. A smelter can recover some 20 precious and other non-ferrous metals from shredded end-of-life electronics. Electronic waste and especially electronic parts however have low recycling yields. Electronics pose a recycling challenge both from the point of purity (contaminants) as well as volume. The […]

The selection of components that make up the Bill-of-Material, especially the package type selection, determines the manufacturability and the reliability of the Printed Board Assembly. This workshop presents the EDM-D-002: Electronic Component Specification guideline. It addresses the specification of assembly aspects of components like Moisture and Process Sensitivity levels, solder process compatibility and quality (yield) […]

Low cost, high quality manufacturing demands a proper design. Placement of components need to be aligned with assembly process flow, capability and equipment. This workshop presents the EDM-D-004: Design-for-Assembly guideline. The guideline provides general requirements and recommendations regarding Design-for-Assembly of printed boards. It treats automated board handling, PBA type selection, component placement, compatibility with different […]

Better quality parts lead to faster and more cost efficient assembly and less test failures and repair. Together with quality manufacturing and assembly processes they lead to a quality product with low field failure, low maintenance, a happy customer and a healthy bottom line if the cost of “quality” is limited. Quantifying part and production […]

The basic principles behind Signal Integrity (SI), Power Integrity (PI) and especially Electro-Magnetic compatibility (EMC) are often not well known. Achieving well SI, PI and EMC designed electronics are, therefore, often seen as “Black Magic”. However, appropriate SI, PI and EMC design methodology results in efficient and cost-effective solutions within the proposed time- and cost […]

The Internet-of-Things, electronics everywhere, self-driving cars, body-area-networks monitoring your health, etc. The reliability of these systems is crucial. Therefore, the focus of the Center of Electronics Design & Manufacturing for the coming years will be on electronics reliability supported by the new IWT VIS-traject InProVol “Intelligente Producten met Voorspelbare Levensduur ”. The industry is facing […]

When developing a new product, an electronics designer is faced with a lot of risks to take into account, from the point of view of functionality, performance, design, manufacturability and reliability of the Hardware.cEDM has developed several analysis tools that allow to estimate product reliability risks, help to mitigate the issues, and propose good design […]

cEDM has been active in a wide variety of subjects, all dealing with the realisation of electronics as a physical entity (Design-for-eXcellence) in which product reliability and robustness takes a leading role.. We have looked into the quality of products exiting production, we study mechanisms that create failures during early life and wear-out, we understand […]